| Customization: | Available |
|---|---|
| Integrated Graphics: | Integrated Graphics |
| Main Chipset: | Intel |
|
Still deciding? Get samples of US$ 380/Piece
Request Sample
|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
| Processor system | Intel 12th generation Alder Lake-S series/13th generation Raptor Lake-s series, LGA1700, TDP 65W |
| EFI BIOS | |
| Memory | 2 x DDR4 SO-DIMM, up to 64GB |
| storage |
1 x M.2 M-Key 2280 (NVMe PCIe 3.0_x4) storage interface (NVMe is not supported when the H610 chip is used) |
| 4 x SATA3.0 interface (H610 does not support RAID; H670/Q670 supports RAID0/1/5/10) | |
| 1 x CF card interface (optional, the default is SATA3.0, when using a CF card, one SATA3.0 is required) | |
| show | 1*HDMI2.0 interface, support 4096x2160@60Hz, 1*HDMI2.0 header, support 4096x2160@60Hz |
| Board edge I/O interface |
1 x RJ45 CONSOLE, 2 x USB3.2 |
| 6 x LAN ports (i226; LAN1-2, LAN3-4 support ByPASS) | |
| 4 x SFP 10G (Intel XL710-BM2, optional 2 x SFP 10G, Intel X710-BM2) | |
| Extended Interface/Function |
TPM2.0 is optional, there is no default |
| 1 x USB2.0 2x5Pin, pitch 2.54mm, 1 x USB3.2 2x10Pin, pitch 2.0mm | |
| 1 x PCIe_8X (PCIe5.0_x8 protocol), H610 chip does not support | |
| 1 x M.2 E-Key (PCIe3.0/2.0 protocol, support WIFI/BT module) | |
| 1 x M.2 B-Key (USB2.0/USB3.0 protocol, support 4G/5G module); 1 x Micro SIM card slot | |
| 1 x COM header, 2x5Pin, pitch 2.54mm | |
| 1 x 4Pin intelligent temperature control CPU fan, 2 system fans | |
| power supply | ATX 24+8 Pin power supply, above 300W |
| working environment | Working temperature: -20ºC ~ +60ºC; Working humidity: 5% ~ 90% |
| Storage temperature: -40ºC ~ +85ºC; storage humidity: 5% ~ 90% | |
| operatingsystem support | Windows10, Windows11, Linux |
| size | 255 x 210 mm |
){kind=link}